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Technologies
Uniformity
The critical success factor
Mask Uniformity
Path to wafer uniformity
Wafer Uniformity
Achieving the best process window
GPU Acceleration
Practical full-reticle processing
Curvilinear
Better mask and wafer quality
Pixel Domain
Shape-agnostic computing
Products
PLDC
MPC for uniformity and linearity
TrueMask
®
ILT
Full-chip, Entirely Manufacturable™ ILT
TrueModel
®
Physical model for masks and wafers
CDP
GPU-accelerated design platform
About D
2
S
About D
2
S
Timeline of D
2
S Technology Highlights
Technologies
Uniformity
The critical success factor
Mask Uniformity
Path to wafer uniformity
Wafer Uniformity
Achieving the best process window
GPU Acceleration
Practical full-reticle processing
Curvilinear
Better mask and wafer quality
Pixel Domain
Shape-agnostic computing
Products
PLDC
MPC for uniformity and linearity
TrueMask
®
ILT
Full-chip, Entirely Manufacturable™ ILT
TrueModel
®
Physical model for masks and wafers
CDP
GPU-accelerated design platform
About D
2
S
About D
2
S
Timeline of D
2
S Technology Highlights
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News
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Page 4
Tuesday, October 24, 2023
Aki Fujimura, CEO of D
2
S, recaps why manufacturing curvy masks makes curvy design now possible along with key points made by the DAC panel on the benefits and barriers
English
Monday, April 24, 2023
Photomask Japan: D
2
S Solutions for Curvy Masks
English
Wednesday, April 12, 2023
Semiconductor Engineering: How Curvilinear Mask Writing Affects Chip Design
English
Tuesday, January 10, 2023
Aki Fujimura of D
2
S explains the advantages of pixel-based computing with GPU acceleration.
English
Tuesday, January 10, 2023
Abhishek Shendre of D
2
S presents the Best Paper awarded at SPIE Photomask 2022.
English
Tuesday, December 13, 2022
Semiconductor Engineering: Increased Photomask Density And Its Impact On EDA
English
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