News

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eBeam Initiative Roadmap to Focus on Semiconductor Photomask Critical Dimension Uniformity at SPIE Advanced Lithography 2012 Symposium – Proof Points at SPIE demonstrate the ability of eBeam Technologies to Improve 20-nm and 14-nm Wafer Yields

Press Release • February 13, 2012

Proof points at SPIE Advanced Lithography demonstrate the ability of eBeam technologies to improve 20‐nm and 14‐nm wafer yields

D2S Expands Management Team with Photomask and Semiconductor Industry Veterans – New Hires from Intel, KLA-Tencor and Synopsys Bring Wealth of Semiconductor Experience as D2S Enters Next Stage of Growth

Press Release • February 13, 2012

New Hires from Intel, KLA‐Tencor and Synopsys Bring Wealth of Semiconductor Experience as D2S Enters Next Stage of Growth

DFeB Technology Leader D2S Appoints New President of Japanese Subsidiary

Press Release • October 1, 2011

D2S Unveils Industry's First Mask-Wafer Double Simulation Platform

Press Release • September 20, 2011

TrueMask® DS enables interactive optimization of mask write‐times and wafer quality

D2S Taps Industry Semiconductor EDA Veteran to Serve as Vice President of Engineering

Press Release • March 29, 2011

D2S Fills Critical Role as Momentum Builds to Support Cost‐Effective 20‐nm Optical Lithography

Fellow eBeam Initiative Members D2S and NuFlare Partner to Reduce Write Times for Complex 22-nm Photomask – D2S Option to NuFlare EBM-700 System Enables Design for eBeam (DFEB) Mask Technology

Press Release • March 1, 2011

D2S Option to NuFlare EBM‐7000 System Enables Design for E‐beam (DFEB) Mask Technology