Better Wafers with Faster eBeam Write Times
The Dawn of the eBeam Decade | Lithography has historically been one of the key engines of semiconductor innovation. Today, the limits of lithography drive the need for innovative eBeam technologies.
About D2S | D2S, Inc. is an emerging company providing a computational design platform to maximize existing eBeam technology to reduce mask costs for both low and high volume applications. D2S® design-for-eBeam (DFeB) mask technology reduces mask write times for high-volume designs with complex and circular features using existing eBeam mask writing equipment. D2S DFeB direct write technology virtually eliminates the costs of masks for low-volume applications and can speed time-to-market by shortening the design-to-lithography process flow. In 2009, D2S, Inc. created the eBeam Initiative as a forum for DFeB education and promotion across the semiconductor ecosystem.
eBeam Initiative | D2S helped drive the creation of the eBeam Initiative, laying the foundation for an industry-wide ecosystem to accelerate the development of eBeam technology. >>visit www.ebeam.org
All designs at advanced nodes, regardless of lithographic approach, require eBeam technology
Complex masks extend the viability of 193i optical lithography but create impossible mask write times
