Technology | DFEB is a design and software approach to enhance the throughput of e-beam lithographic exposure.  DFEB uses character projection (CP) technology combined with design and software techniques to reduce a design's required shot count.  DFEB direct write technology, introduced in October 2008, results in increased CP e-beam direct-write (EbDW) throughput.  DFEB mask technology, introduced in February 2010, enables the extension of 193-nm immersion lithography to the 22-nm node and beyond with practical mask costs and turnaround time.



DFEB Direct Write Applications | Systems companies seeking all-layer custom SoC prototypes; low-to-mid-volume semiconductor companies producing maskless test chips, engineering samples, and derivative chips; and supercomputing applications.

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DFEB Mask Applications | High to mid-volume semiconductor companies producing SoCs at the 32-nm node and below.

>>read more (link to the PDF of the DFEB mask technology backgrounder that will be finalized around Feb 8, 2010)