TrueMask™ DS Mask-Wafer Double Simulation Platform
As the size of mask features moves into the sub‐80nm realm, mask accuracy has become an increasingly difficult problem with increasing impact on wafer yield. D2S TrueMask DS accelerated workstation is the first and only mask‐wafer double simulation platform for R&D exploration, bit‐cell design, hot‐spot analysis, and mask‐defect categorization that comprehends overlapping shots and dose modulation.
Benefits
Additionally for memory cells:
Press Release (PDF)
Datasheet (PDF)
- Interactive visualization of the impact of a change in mask shapes in the wafer plane.
- Interactive optimization of mask shot‐count and wafer quality using the benefits of overlapping shots and dose modulation
- Interactive visualization for hot‐spot and failure analysis, as well as for process development
- Productivity gains for mask model calibration and exploration during process development
Additionally for memory cells:
- Improved wafer yield
- Improved throughput for mask production through reduced mask shot‐count
Press Release (PDF)
Datasheet (PDF)
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White areas show the eBeam simulation overlapping shots highlighted with blue outline |
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Shows slope of eBeam simulation intensity dope map at threshold point, for analysis Green = good slope (steep) Yellow = ok Red = bad slope (shallow) |
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Dark outline shows the simulation of mask-process effects that form the input to lithography simulation |
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Lithography simulation, with light intensity plot |
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Lithography simulation without light intensity plot Purple outline shape is input CAD data |