TrueMask® DS Mask-Wafer Double Simulation Platform
As the size of mask features moves into the sub‐80nm realm, mask accuracy has become an increasingly difficult problem with increasing impact on wafer yield. D2S TrueMask DS accelerated workstation is the first and only mask‐wafer double simulation platform for R&D exploration, bit‐cell design, hot‐spot analysis, and mask‐defect categorization that comprehends overlapping shots and dose modulation.
Benefits
  • Interactive visualization of the impact of a change in mask shapes in the wafer plane.
  • Interactive optimization of mask shot‐count and wafer quality using the benefits of overlapping shots and dose modulation
  • Interactive visualization for hot‐spot and failure analysis, as well as for process development
  • Productivity gains for mask model calibration and exploration during process development

Additionally for memory cells:
  • Improved wafer yield
  • Improved throughput for mask production through reduced mask shot‐count


Press Release (PDF)
Datasheet (PDF)
eBeam Simulation
White areas show the eBeam simulation overlapping shots highlighted with blue outline
DM/Edge Slope Analysis
Shows slope of eBeam simulation intensity dope map at threshold point, for analysis

Green = good slope (steep)
Yellow = ok
Red = bad slope (shallow)
Mask Process Simulation
Dark outline shows the simulation of mask-process effects that form the input to lithography simulation
Lithography Simulation
Lithography simulation, with light intensity plot
Lithography Contour Simulation
Lithography simulation without light intensity plot
Purple outline shape is input CAD data