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D2S Redefines Mask Rules for the 22-nm and Smaller Technology Nodes

Press Release • February 23, 2010

Design for eBeam (DFEB) Mask Technology Makes Advanced Photomask Production Practical
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eBeam Initiative Introduces Design for eBeam Methodology Guidelines and Training Courses

Press Release • November 9, 2009

Guidelines and Training Build on Milestones Achieved During 2009   
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D2S to Speak at the International Conference on Computer-Aided Design

Press Release • October 12, 2009

Tutorial to Further Educate Design Community on the Future of E‐beam Direct Write Technologies
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eBeam Initiative Members Collaborate to Enhance Design for eBeam Throughput:

Press Release • October 1, 2009

D2S' DFEB Packed Stencil Technology and Advantest Corporation’s Direct Write Lithography Equipment Increase DFEB Character Set by More Than 4X, October 1, 2009
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日本語

Silicon Results Validate Design for eBeam Methodology at the 65-nm node

Press Release • May 26, 2009

D2S, e-Shuttle and Fujitsu Microelectronics Collaborate On First Test Chip
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日本語

Kazuyuki Kawauchi, former CEO of Fujitsu Microelectronics America, Appointed President of D2S KK

Press Release • April 21, 2009

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