eBeam Initiative | The eBeam Initiative provides a forum for educational and promotional activities regarding new semiconductor manufacturing approaches based on electron beam (eBeam) technologies. The goals of the Initiative are to reduce the barriers to adoption to enable more integrated circuit (IC) design starts and faster time-to-market while increasing the investment in eBeam technologies throughout the semiconductor ecosystem. Members and advisors, which span the semiconductor ecosystem, include: Abeam Technologies, Advantest, Alchip Technologies, AMTC, Applied Materials, Artwork Conversion, Cadence Design Systems, CEA/Leti, D2S, Dai Nippon Printing, EQUIcon Software GmbH Jena, e-Shuttle, Jack Harding from eSilicon Corporation, Fastrack Design, Fraunhofer CNT, Fujitsu Semiconductor Limited, GenISys GmbH, GLOBALFOUNDRIES, Grenon Consulting, HOYA Corporation, IMS CHIPS, JEOL, KLA-Tencor, Magma Design Automation, Mentor Graphics Corporation, Multibeam Corporation, NCS, NuFlare Technology, Petersen Advanced Lithography, Colin Harris from PMC-Sierra, Riko Radojcic from Qualcomm, Samsung Electronics, SoftJin Technologies, STMicroelectronics, Synopsys, Tela Innovations, TOOL Corporation, Toppan Printing, Vistec Electron Beam Lithography Group, and Xilinx. Membership is open to all companies and institutions throughout the electronics industry. To find out more, please visit www.ebeam.org.
JEOL | General Manager of Semiconductor Equipment Business Operations at JEOL, W. Wakamiya, explained, "Our new JBX-3200MV system is an example where together with D2S' model-based MDP technology, we were able to produce a mask writer that is particularly suitable for the 22-nm node where circular main features and curvilinear assist features will become increasingly desirable. We value our partnership with D2S as we continue to develop cost-effective solutions for the production of advanced optical photomasks." To find out more about JEOL, please visit www.jeol.com.
NuFlare | Hirokazu Yamada, senior manager for strategic planning, Mask Lithography Division, NuFlare Technology, Inc., explained, "Our EBM-7000 system together with D2S DFEB mask technology enables our customers to reduce the shot count required to write complex masks and is particularly suitable for the 22-nm node. The ability to optimize the DFEB mask technology for the EBM-7000 and next-generation systems using overlapping shots will help broaden the adoption. We value our partnership with D2S as we continue to develop cost-effective solutions for the production of advanced optical photomasks." To find out more about NuFlare Technologies, please visit www.nuflare.co.jp/english.