Press Releases
eBeam Initiative Members Jointly Present Collaborative Results at SPIE/BACUS Symposium 2010 – Four New Companies Join eBeam Initiative
Sep. 7, 2010
View the full press release in English & Japanese
D2S CEO AKI FUJIMURA TO PARTICIPATE IN 22‐NM MANUFACTURING PANEL AT DAC 2010
May. 25, 2010
View the full press release in English
eBeam Initiative Members Publish Collaborative Results at Photomask Japan 2010 – Three New Companies Join eBeam Initiative
Apr. 13, 2010
View the full press release in English & Japanese
D2S and JEOL Partner to Reduce Write Times for Advanced Photomask Production
Apr. 13, 2010
View the full press release in English & Japanese
D2S Redefines Mask Rules for the 22-nm and Smaller Technology Nodes
Feb. 23, 2010
View the full press release in English & Japanese
eBeam Initiative Membership Grows to 27 - Initiative Introduces DFEB Mask Roadmap for High Volume Integrated Circuits
Feb. 23, 2010
View the full press release in English & Japanese
eBeam Initiative Introduces Design for E-Beam Methodology Guidelines and Training Courses
Nov. 9, 2009
View the full press release in English.
D2S to Speak at the International Conference on Computer-Aided Design
Oct. 12, 2009
View the full press release in English
eBeam Initiative Members Collaborate to Enhance Design for E-Beam Throughput:
Oct. 1, 2009
D2S' DFEB Packed Stencil Technology and Advantest Corporation’s Direct Write Lithography Equipment Increase DFEB Character Set by More Than 4X, October 1, 2009
View the full press release in English & Japanese
Silicon Results Validate Design for e-Beam Methodology at the 65-nm node
May. 26, 2009
View the full press release in English & Japanese
Kazuyuki Kawauchi, former CEO of Fujitsu Microelectronics America, Appointed President of D2S KK
Apr. 21, 2009
View the full press release in Japanese only
D2S Secures $9 Million In Series B Financing
Apr. 1, 2009
View the full press release in English
eBeam Initiative Members to Present at Magma User Conference
Mar. 26, 2009
View the full press release in English
20 Electronic Industry Leaders Collaborate to Accelerate Development and Adoption of Design for E-Beam Technology
Feb. 24, 2009
View the full press release in English, Japanese, Chinese (SC) & Chinese (TC)
Vistec, CEA/Leti and D2S Join Forces on E-Beam Direct Write Solutions for the 45- and 32-nm Nodes
Jan. 12, 2009
View the full press release in English & Japanese
Fujitsu Microelectronics, e-Shuttle and D2S to Develop Maskless ICs.
Oct. 8, 2008
View the full press release in English & Japanese