Press Releases
D2S Redefines Mask Rules for the 22-nm and Smaller Technology Nodes
Feb. 23, 2010
View the full press release in English & Japanese
eBeam Initiative Membership Grows to 27 - Initiative Introduces DFEB Mask Roadmap for High Volume Integrated Circuits
Feb. 23, 2010
View the full press release in English & Japanese
eBeam Initiative Introduces Design for E-Beam Methodology Guidelines and Training Courses
Nov. 9, 2009
View the full press release in English.
D2S to Speak at the International Conference on Computer-Aided Design
Oct. 12, 2009
View the full press release in English
eBeam Initiative Members Collaborate to Enhance Design for E-Beam Throughput:
Oct. 1, 2009
D2S' DFEB Packed Stencil Technology and Advantest Corporation’s Direct Write Lithography Equipment Increase DFEB Character Set by More Than 4X, October 1, 2009
View the full press release in English & Japanese